边缘设备的散热挑战

3.0 2025-05-12 32 0 3670 KB 25 页 PDF
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边缘设备的散热挑战
边缘设备的散热挑战
边缘设备的散热挑战
边缘设备的散热挑战
边缘设备的散热挑战
摘要:

Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.On-device AI and its thermal implicationsNader Nikfar, Sr. Dir. of TechnologyQualcomm Technologies, Inc.HotChips, Aug. 2024Agenda1.What is on-device AI?2.Benefits & importance3.Use-case evolution4.Thermal Implications5.Potential solutions6.Summary3What ison-device AI?4AI is transforming …5Intelligence is moving towards edge devices•Running machine learning on devices like smartphones, laptops, and cars, instead of cloud.•On-device AI utilizes on-chip processors such as NPU, CPU, and GPU.•Current on-device AI can support inferences on multiple platforms.•Cloud is currently necessary for pooling of big data and training AI inference algorithms,andit complements on-device processing.SOC consist of several processors integrated into the same dieDevices, machines, and things are becoming more intelligentOn-device and AI go hand in hand6Al apps enabled by on-device Generative AI7Benef

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