在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由

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在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由
在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由
在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由
在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由
在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由
摘要:

INNOVATIVE TECHNOLOGIES SUDDEN SERVICE GLOBAL REACHOptimizing Data Routing via Copper & Optical Interconnects in Scalable AI Hardware ArchitecturesMatthew BurnsGlobal Director, Technical MarketingSeptember 10, 2024Samtec ConfidentialOptimized Data Routing - How??? 1.21 GW!224 Gbps / SIFabricsDisaggregationThermal ReliefScalabilityMemoryAccessOpticsSamtec ConfidentialKey AI Hardware ApplicationsCHIPSETSSoMs/CoMsACCELERATORSDSAsSamtec ConfidentialAI Chipsets/Characterization Platforms•A number of emerging AI chipset options from a variety of suppliers•SoCs, CPU, GPU, TPU, Digital Compute, Analog Compute, etc.•Fine-tuned for training or inference whether at edge or in the data center•AI system development typically links AI chipset development boards mimicking end applications•AI chipset I/O expansion opportunities aboundSamtec ConfidentialSamtec Bulls Eye® High-Performance Test•The high-density array designs and advanced cabling solutions support T&M applications to 70 GHz•90 GHz solu

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在可扩展的AI硬件架构中通过铜缆和光互连优化数据路由

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